CNP OM362
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Ultra-Low BTC Voiding
- Eight-Hour Print Stability
- Fine-Pitch SIR Performance
Product Description
ALPHA OM-362 Solder Paste is a lead-free, zero-halogen, no-clean solder paste for high-reliability surface-mount assembly. The product uses Type 4 powder and is available with SAC305 or Innolot alloys. It delivers IPC-7095 Class III voiding on BGA components and averages less than 10% voiding on bottom-terminated components. Its eight-hour stencil life covers both ambient and elevated conditions, while the reflowed residue passes multiple surface-insulation-resistance and electrochemical-migration tests. Alloy, metal load and package options are selected to match the assembly process.
Key features
- Ultra-Low Voiding: achieves IPC-7095 Class III BGA voiding and less than 10% average BTC voiding under the stated test conditions
- Eight-Hour Stencil Life: maintains consistent transfer efficiency for eight hours at 25 deg C/50% RH and 30 deg C/65% RH
- Electrochemical Reliability: passes SIR and migration tests at fine conductor spacing after reflow
Applications
High-reliability surface-mount PCB assembly, including BGA and bottom-terminated component processes.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
Values apply to the published ALPHA OM-362 base product; alloy and package vary by configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Powder size | Type 4 | Published product configuration | |
| Flux classification | ROL0 | IPC J-STD-004B | |
| Tack retention | Pass | 24 hours at 50% RH; IPC J-STD-005 / IPC-TM-650 2.4.44 | |
| Stencil life, ambient | 8 | hours | Consistent transfer efficiency at 25 deg C/50% RH |
| Stencil life, elevated | 8 | hours | Consistent transfer efficiency at 30 deg C/65% RH |
| Cold slump | Pass; no bridging above 0.20 | mm | 25 deg C/50% RH; IPC J-STD-005A |
| Hot slump | Pass; no bridging above 0.25 | mm | 150 deg C for 10 minutes; IPC J-STD-005A |
| Spread | Approximately 80 | % | JIS Z 3197:1999 8.3.1.1 |
After-processing / final-state properties
Results apply to reflowed ALPHA OM-362 under the listed test conditions; alloy and assembly configuration remain test-specific.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| BGA voiding classification | Class III | IPC-7095; published base-product result | |
| Average BTC voiding | Less than 10 | % | Bottom-terminated components; published base-product result |
| Surface insulation resistance | >=1.0 x 10^8 | ohm | 7 days at 85 deg C/85% RH; 200 um spacing; IPC J-STD-004C / IPC-TM-650 2.6.3.7 |
| Surface insulation resistance | >=1.0 x 10^8 | ohm | 7 days at 40 deg C/90% RH; 200 um spacing; IPC J-STD-004B / IPC-TM-650 2.6.3.7 |
| Surface insulation resistance | >=1.0 x 10^8 | ohm | 7 days at 40 deg C/93% RH; JIS Z 3197:1999 8.5.3 |
| Electrochemical migration | Pass; no visible corrosion, discoloration or migration | 1,000 hours at 85 deg C/85% RH; JIS Z 3197:1999 8.5.4 |
