CNP OM338PT
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Fine-feature solder paste with demonstrated full alloy coalescence on circular deposits as small as 0.225 mm using a 0.100 mm stencil.
- Supports print speeds up to 150 mm/s with an 8-hour stencil life and is formulated for increased in-circuit pin-test yields.
- ROL0, halogen-free no-clean formulation with IPC-7095 Class 3 voiding performance and documented electrical reliability results.
Product Description
ALPHA OM-338-PT Solder Paste is a lead-free, no-clean solder paste engineered for fine-feature printing, high-throughput processing, and improved in-circuit pin-test yields. Its broad processing window supports standard and fine-pitch stencil printing, with print speeds from 25 to 150 mm/s and demonstrated full alloy coalescence on circular deposits as small as 0.225 mm using a 0.100 mm stencil. The paste provides good solderability across various board and component finishes, including CuOSP, while offering resistance to random and mid-chip solder balling. ALPHA OM-338-PT is classified ROL0, is halogen-free, supports air or nitrogen reflow, and meets IPC-7095 Class 3 voiding performance.
Key features
- Fine-feature printing capability: Demonstrated full alloy coalescence on circular dimensions as small as 0.225 mm (0.011 in) with a 0.100 mm (4 mil) stencil.
- High-throughput printing: Supports print speeds from 25 to 150 mm/s (1 to 6 in/s) with an 8-hour stencil life at 50% RH and 23 °C.
- Pin-testable no-clean performance: Formulated for increased in-circuit pin-test yields compared with ALPHA OM-338 without compromising electrical reliability.
- Controlled voiding and solder balling: Meets IPC-7095 Class 3 voiding performance and provides resistance to random and mid-chip solder balling.
Applications / Suitable for
- Standard and fine-pitch stencil printing
- High-throughput SMT assembly
- Assemblies requiring in-circuit pin testing
- Lead-free soldering using air or nitrogen reflow
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
Selected properties and available configurations of ALPHA OM-338-PT before reflow.
| Property | Value | Method or condition |
|---|---|---|
| Available alloys | SAC305, SAC350, SAC387, SAC405, SACX Plus 0307, SACX Plus 0807 | e1 alloys per JESD97 Classification |
| Powder size | Type 3, Type 4, Type 4.5 | Available configurations |
| Stencil life | 8 hours | 50% RH, 23 °C (74 °F) |
| Flux classification | ROL0 | IPC J-STD-004A |
| Halide content | Halide free | By titration, IPC J-STD-004A |
After-processing / final-state properties
Selected electrical reliability and soldering performance results for ALPHA OM-338-PT under the stated test conditions.
| Property | Result | Method or condition |
|---|---|---|
| SIR | Pass, 4.1 x 109 ohms | IPC J-STD-004A; 7 days at 85 °C/85% RH; pass >= 1 x 108 ohm |
| SIR | Pass, 8.4 x 1011 ohms | Bellcore GR78-CORE; 96 hours at 35 °C/85% RH; pass >= 1 x 1011 ohm |
| Electromigration | Pass; initial 3.8 x 109 ohms, final 1.9 x 109 ohms | Bellcore GR78-CORE; 65 °C/85% RH, 10 V, 500 hours; pass = final > initial/10 |
| Voiding performance | Class 3 | IPC-7095; acceptable voiding obtained within the documented SAC reflow profile range |
| Copper corrosion | Pass, no evidence of corrosion | IPC J-STD-004A |
