ALPHA HT-130DM

Harmonization Code : 3208.20.90 | Paints and varnishes that are dispersed or dissolved in a non aqueous medium

ALPHA HT-130DM

Main features

  • Non-Sag High-Speed Dispensing
  • Fast 80-Second Heat Cure
  • High-Resistance Electrical Insulation

Product Description

ALPHA HiTech HT-130DM SMD Adhesive is a one-part, red epoxy paste for heat-cured attachment of surface-mount components in electronics assembly. It is formulated for high-speed dispensing and screen printing, with non-sag behavior and a thixotropic index above 4.0. A typical seven-day pot life at 25 deg C provides an extended working window, while a representative convection-oven cure is 80 seconds at 150 deg C. After cure, the material has 80 to 90 Shore D hardness and a glass transition temperature of at least 100 deg C. The adhesive is used for surface-mount component attachment in assembly processes that include wave soldering.

Key Features

  • Controlled deposition: Non-sag epoxy paste supports high-speed dispensing and screen printing.
  • Fast heat cure: Representative convection-oven cure is 80 seconds at 150 deg C; actual cure depends on equipment and assembly conditions.
  • Electrical insulation: Cured insulation resistance is at least 1 x 10^12 ohm after 95 hours at 40 deg C and 95% RH.

Applications

Heat-cured attachment of surface-mount components in electronics assembly, including processes with wave soldering.

Product Family

ALPHA HT-130DM

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
SolidsSolids
2.2 %
Specific GravitySpecific Gravity
0.790 ± 0.003 @25°C

Additional Information

Typical Properties

As Supplied

Typical uncured-material values unless otherwise stated.

PropertyTypical ValueUnitsMethod or Condition
Form and colorRed pasteAs supplied
Viscosity550 to 650PoiseMalcom PC-10A, 30 rpm, 25 deg C
Thixotropic index> 4.0Typical
Specific gravity1.0 to 1.4Typical
Pot life7days25 deg C
Shelf life6months1 to 10 deg C

Typical Properties

Final State

Typical cured-material values. The source does not state one common cure schedule for every test specimen.

PropertyTypical ValueUnitsMethod or Condition
Hardness80 to 90Shore DCured material
Glass transition temperature>= 100deg CDSC
CTE below Tg65 +/- 10ppm/deg CCured material
CTE above Tg180 +/- 20ppm/deg CCured material
CorrosionNone95 hours at 40 deg C and 95% RH
Moisture absorption< 1% by weight24 hours in water at 25 deg C
Insulation resistance>= 1 x 10^12ohm95 hours at 40 deg C and 95% RH

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