ALPHA EF6000

ALPHA EF-6000 Liquid Soldering Flux is an active, rosin-free, low-solids, low-residue no-clean alcohol-based flux for lead-free and tin-lead wave and selective soldering. Typical solids content is 2.2%, supporting minimal residue and pin testability after soldering. The formulation has a broad thermal process window and is designed to maintain hole fill across varying preheat temperatures and dwell times. Additives reduce the tendency for solder balling, while the thermally stable formulation helps reduce bridging during dual-wave processing. The product is classified ORL0 under IPC J-STD-004 and is supplied as a clear to pale-yellow liquid.

Key features

• Rosin-free low-residue chemistry: A 2.2% solids no-clean formulation minimizes deposited residue and supports pin-test access after soldering.
• Broad thermal process window: Supports lead-free and tin-lead wave or selective soldering across varying preheat temperatures and dwell times.
• Solder ball and bridging control: The formulation is designed to reduce solder-ball generation and bridging during wave and selective soldering.

Applications

Used for lead-free and tin-lead wave or selective soldering of assemblies that require low residue, pin testability, and a broad process window.