ALPHA EF-9301
Harmonization Code : 3404.90.00.00 | Artificial waxes and prepared waxes : Other
Main features
- Greater Than 95% Hole Fill
- Low-Bridging SMT Soldering
- Spray or Foam Fluxing
Product Description
ALPHA EF-9301 Liquid Soldering Flux is a rosin-containing, ready-to-use liquid flux developed for full-dulling wave soldering with tin-lead and lead-free alloys. Spray or foam application produces smooth, dull solder joints with evenly spread, low-tack residue. On connectors and bottom-side SMT components, the flux shows low bridging together with strong hole fill and low solder balling. Hole-fill yield is greater than 95% on 10 mil holes. The typical solids level is 7.0%, with specific gravity of 0.798 +/- 0.005 at 25 deg C and ROM1 classification. Separate process recommendations cover preheat and solder-pot temperatures for tin-lead and lead-free operation.
Key Features
- High hole-fill yield: Greater than 95% hole-fill yield on 10 mil holes.
- Low-bridging soldering: Low bridging on connectors and bottom-side SMT components.
- Flexible flux application: Ready for spray or foam application in tin-lead and lead-free processes.
Applications
Wave soldering with tin-lead and lead-free alloys using spray or foam flux application.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
Typical Properties
As Supplied
Typical values for the ready-to-use liquid flux.
| Property | Typical Value | Units | Method or Condition |
|---|---|---|---|
| Appearance | Clear, pale yellow liquid | Visual | |
| Solids content | 7.0 | % by weight | Typical |
| Specific gravity | 0.798 +/- 0.005 | 25 deg C | |
| Acid number | 16 to 17 | mg KOH/g | Typical |
| pH | 3.6 | Typical | |
| Flash point | 12 | deg C | T.C.C. |
| Shelf life | 360 | days | Typical |
| Flux classification | ROM1 | J-STD-004 |
