3M 583
Harmonization Code : 3919.10.80 | Other self-adhesive plastic rolls not exceeding 20 cm wide.
Main features
- Controlled Electronic Film Bondlines
- Heat-and-Pressure Thermal Bonding
- PCB Glass-Fabric Splicing Fit
Product Description
3M Thermal Bonding Film 583 is a thin, flexible, slightly tacky thermosetting nitrile-phenolic bonding film for controlled electronic assembly bondlines. The preformed adhesive film is supplied with a release liner and is activated by documented heat and pressure during assembly. Its film format provides a defined adhesive layer for placement before thermal bonding without a liquid-dispensing step. The product is used for printed-circuit-board glass-fabric splicing and for bonding compatible electronic components, substrates, and flexible assemblies under the specified heat-and-pressure process conditions.
Key features
- Heat-and-pressure activation: The thermosetting nitrile-phenolic film develops its bond under documented heat and pressure during assembly.
- Thin flexible film format: A thin, flexible, slightly tacky preformed layer supports controlled adhesive placement in electronic assembly bondlines.
- Release-lined handling: The release liner protects the bonding film before placement and thermal activation.
Applications
Applications include printed-circuit-board glass-fabric splicing and bonding compatible electronic components, substrates, and flexible assemblies under documented heat and pressure conditions.
